RIGID-FLEX

PCB Portfolio

RIGID-FLEX

Rigid flex PCBs is a complicated product that demands a lot of interaction between our and your technicians. Like other complex products, early discussions between TCX and the designer is necessary to optimize the design for manufacturability and to optimize costs. There are numerous, different structures available. The more common ones are defined below:

Traditional rigid flex construction (IPC-6013 type 4) Multilayer rigid and flexible circuit combination containing three or more layers with plated through holes. 
Asymmetrical rigid flex construction, where the FPC is situated on the outer layer of the rigid construction. Containing three or more layers with plated through holes.
Multilayer rigid flex construction with buried / blind via (microvia) as part of the rigid construction. 2 layers of microvia are achievable. Construction may also include two rigid structures as part of a homogeneous build. Capability is 2+n+2 HDI structure.

Please contact us if you need further information or assistance, we are happy to help you.

FPC/ Rigid-flex PCB   Manufacturing Capability

Feature

Standard

Advanced

Layer count

6L

HDI 2 step

Material Type

General flex, LCP, Panasoinc,   Dupont, Shengyi, Taiflex

Board thickness

0.04-2.0mm

Board thickness tolerance

±0.05mm

Max size

480*1200mm

Outline tolerance

±0.05mm

Dielectric layer thinckness

0.013-0.15mm

Outlayer copper thickness

18-280um

Innerlayer copper thickness

18-105um

Min line width/ space

0.05mm

Finished hole size

0.1-6.35mm

0.05-6.35mm

Hole tolerance

±0.05mm

Hole position tolerance

±0.05mm

Plugged hole size

0.25-0.60mm

Thickness aperture ratio

8:01

Min. solder mask dam

0.075mm

Min. solder mask isolation ring

0.05mm

Coverlay

yellow, black, white, red

Others

PI thickness

12.5-25um

AD thickness

15-50um

Stiffener

PI: 0.05-0.25MM, FR4, Al, copper

Impedance Tolerance

±10%

Surface treatment

ENIG, immersion silver, OSP, gold   finger

HAL, LF HAL