The first category is what we call “standard” and means we can offer for both prototypes and productions orders. The second is our “advanced” offering, and this shows the very best that we can offer for prototypes.
Feature | 2023 Standard | Advanced | 2024 | 2025 |
| Materials Please contact us for full details regarding material availability. | RIGID: CEM-3, FR4 (standard – halogen free – high performance) Hydrocarbon, High CTI (0), High thermal conductivity, PI Including: ShengYi, Iteq, NanYa, Kingboard, TUC FLEX: PI, PET, PSA,SUS,LPISM,Silver ink and Carbon ink ,Metal dome ,Underfill glue Including: Taiflex, Dupont FR & AP,ShengYi, IMS: Bergquist MP, ITEQ T-Lam, Taiflex, Dupont FR & AP, ShengYi, Boyu | RIGID: Mid – Loss material TUC TU862HF, EMC EM370D, ITEQ IT170GRA, N4000-13(series), FR408HR, S7439, TU872SLK (series), EM-828, Megtron-6,RO4350B, RO3000(series) ,TLX (series), FLEX: PI, Include: Dupont, Panasonic IMS Al & Cu based Include: Bergquist HPL, Ventec VT, Arlon | ‘Advanced’ materials becoming more mainstream across the supply base. Non reinforced materials will increase in line with with UHDI emerging. | ‘Advanced’ materials becoming more mainstream across the supply base. Non reinforced materials will increase in line with with UHDI emerging. |
| Minimum dielectric thickness | 0.05mm for PCB 0.025mm for FPC | 0.025mm for PCB 0.012mm for FPC | ≤0.05mm for PCB 0.01mm for FPC | ≤0.05mm for PCB 0.01mm for FPC |
| Layer count | 1 – 42L / 50L QTA | 64L (pilot runs) | 64L (pilot runs) | 64L (pilot runs) |
| HDI / Buried – blind via | Y (2+n+2) | Y (4+n+4 / ELIC) | Y (U-HDI) | Y (U-HDI) |
| Copper filled BVH (Y/N) | Y | Y | Y | Y |
| Copper filled PTH (Y/N) | Y- copper paste | Y – copper paste | Y | Y |
| Copper paste filled PTH (Y/N) | Y | Y | Y | Y |
| Capped via (Y/N) | Y | Y | Y | Y |
| LDI (Y/N) | Y | Y | Y | Y |
| Maximum board size (mm) | 1180 X 610 | 1400 X 610 | 1400 X 610 | 1400 X 610 |
| Minimum board thickness (mm) 2L | 0.15mm for PCB 0.05mm for 1L FPC 0.12mm for 2L FPC | 0.15mm for PCB 0.05mm for 1L FPC 0.12mm for 2L FPC | 0.08mm for PCB 0.05mm for 1L FPC 0.12mm for 2L FPC | 0.08mm for PCB 0.05mm for 1L FPC 0.12mm for 2L FPC |
| Minimum board thickness (mm) ≥4L | 0.25mm for PCB 0.20 for FPC | 0.25mm for PCB 0.16 for FPC | 0.13 mm for PCB 0.13 for FPC | 0.13 mm for PCB 0.13 for FPC |
| Maximum board thickness (mm) | 8.6mm | 10.0mm | 10.0mm | 10.0mm |
| Minimum track / gap IL (mil) – copper weight dependant | 0.06mm for PCB 0.025mm for FPC | 0.030mm for PCB 0.025mm for FPC | 0.025mm for PCB 0.020mm for FPC | 0.015mm for PCB 0.015mm for FPC |
| Minimum track / gap OL (mil) – copper weight dependant | 0.075mm for PCB 0.04mm for FPC | 0.050 mm for PCB 0.030 mm for FPC | 0.025mm for PCB 0.020mm for FPC | 0.015mm for PCB 0.015mm for FPC |
| Surface finish | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF/ENEPIG | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF//IAG+GF/Isn+GF | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF//IAG+GF/Isn+GF | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF//IAG+GF/Isn+GF |
| Layer to layer registration | 0.05mm for PCB 0.02mm for FPC | 0.025mm for PCB 0.02mm for FPC | 0.025mm for PCB 0.02 for FCP | 0.025mm for PCB 0.02 for FCP |
| Minimum hole (mech) (mm/mil) | 0.2mm | 0.2mm | 0.15mm | 0.15mm |
| Minimum hole (laser) (mm/mil) | 0.1mm | 0.1mm | 0.1mm | 0.1mm |
| Aspect ratio PTH | 10:1 | 10:1 | 10:1 | 10:1 |
| Aspect ration BVH | 0.9:1 | 1.3:1 (factory + design dependant) | 1.3:1 (factory + design dependant) | 1.3:1 (factory + design dependant) |
| Finish hole tolerance (PTH) | ± 0.076mm | ± 0.05mm | ± 0.05mm | ± 0.03mm |
| Finish hole tolerance (NPTH) | ±0.0375 | ±0.025 | ±0.025 | ±0.025 |
| Maximum Cu weight OL | 6oz | 6oz | 6oz | 6oz |
| Maximum Cu weight IL | 6oz | 6oz | 6oz | 6oz |
| Controlled impedance (+/- X%) | Others ± 10% | ± 5% | ± 5% | ± 5% |
| Rigid-flex (Y/N) | Y | Y | Y | Y |
| Flexible (Y/N) | Y | Y | Y | Y |
| IMS (Y/N) | Y (Al) | Y (both Al and Cu) | Y (both Al and Cu) | Y (both Al and Cu) |
| Embedded components (Y/N) | Y | Y | Y | Y |
| Soldermask via plugging IPC4761 Type VI (Y/N) | Y | Y | Y | Y |
| Epoxy via plugging IPC4761 Type VI (Y/N) | Y | Y | Y | Y |
| Epoxy via plugging IPC4761 Type VII (Y/N) | Y | Y | Y | Y |