RF
Radio frequency (RF) PCBs and microwave (MW) circuits can be found in wireless products from handheld devices for medical and industrial applications to advanced communications systems for base stations, radar and global positioning.
TCX works close with your product design team to insure that the project’s cost/performance targets can be met by providing information on material options, relative costs and DFM considerations.
Please contact us if you need further information or assistance, we are happy to help you.
RF Manufacturing Capability | |
Feature | Technical specification |
Number of layers | 2-20 layers |
Technology highlights | Controlled impedance, low loss materials, miniaturization |
Materials | Low loss / low Dk, higher performance FR-4, PPO, Teflon, hydrocarbon / ceramic filled |
Dielectric thickness | 0.1mm – 3.0mm |
Profile method | Routing, v-score |
Copper weights (finished) | H to 6OZ |
Minimum track and gaps | 0.075mm / 0.075mm |
Metal core thickness | 0.4-2mm post bonded |
Maxmimum dimensions | 580mm x 1010mm |
Surface finishes available | HASL (Lead-free), OSP, ENIG, Immersion tin, Immersion silver |
Minimum laser drill | 0.10mm standard, 0.075mm advanced |